Wally
I am a banana!
Maybe that's what the shark is trying to do
Soundtrack for that avatar... At the 5 second mark or so.Maybe that's what the shark is trying to do
I'm not sure how much you know about mold production, but just adding holes at the backside for heat dissipation needs another tool (which is a couple thousand EUR) and you'll see a small recession where that tool is applied.
We're not printing 3D cases here. With molds, you have a top and a bottom. Think about how they're made: They're being drilled with CNC machines from the top and bottom.
If you want to add any holes SIDEWAYS in the case, you can't drill that in the mold, it's physically not possible.
Therefore, for every hole, clip, or whatever that can't be milled, you need an inlay too which needs to be produced additionally and put into the mould each time for production.
No, with the Pandora, compromises had to be made as well.
It's mostly built around the OMAP3: It uses features that the OMAP3 supports (SD Card slots, etc.)
Everything else (touchscreen, Wifi, analog sticks) are standard features for a mobile device as well.
We've added a lot more things in the Pyra (mobile internet), even things that the OMAP5 doesn't support out of the box (like three SD Cards and an eMMC).
The Pandora has nothing like that, AFAIK.
The Pandora was amazing, but there were a lot of compromises that had to be made as well.
Exactly. They could produce better devices that stay cool but the "race" to have the thinnest device makes everything bollocks.Because they're in a race to be the thinnest for some glob forsaken reason. They pack everything so tight there's no room for a heatsink or even air, so they design chips with fast-finish in mind so they can throttle back down, then market them at their top speed. That IS their "handling" it.
Thanks...just what I needed...another disturbing mental imageNow all I can picture is Wally's avatar frenching a gnome.
I would probably be interested in an aluminum case for the Pyra. Just throwing that out there.
I was about to produce the aluminum case in the school I worked in so yes, I know a bit about mold production.
What I understand is that it's too late to modify the cases as it was my suggestion to get an external sided heat dissipator, not drilling holes.
Misinterpretation strikes back. I never said that the OP is perfect for everyone (it is for my needs, also I often use its CPU at 100% overclocked for days).
What I said is that the effort was made towards this goal.
I feel that we still have a margin for optimization with the Pyra, and for the next-gen CPU boards, and the next etc., I express my opinion.
Would it be possible to drill one or two holes next to heat sink? So the hot air with higher pressure could flow outside the case? Or would it not make a difference? I am not talking about production but hardware mods by users.
That's the smart option.Sounds like its best to settle for the 1ghz and look to more power on a future upgrade board.
</edit>* The CPU-Board (CPU, RAM and storage)
* The Mainboard (all ports, Wi-Fi and Bluetooth)
* The Display-Board (for the screen)
What I'm more concerned about is the fact that any new CPU upgrade is going to be a fairly different CPU/SoC. OMAP5 is already several years old and TI clearly isn't going to continue the line. Not to mention a new SoC will have new memory demands, new driver demands, and so on.
Kinda curious, ED, is there any sort of "futureproofing" within the Pyra in that sense? Obviously the CPU board was made to be upgraded, but stuff like the memory is not. If this new SoC can't run on DDR3L (I think what's what's being used, anyway), then those of us who got Pyras are kind of hung out to dry - a form of early adopter tax, as it were. We'd need a motherboard plus a CPU board swap. Even with the potential for a loyalty discount, ED still needs to turn a profit - he can't merely sell the boards at-cost.
Not to mention that the OS has to then check for several hardware configurations, but at least those should be pretty consistent to test for.
I always thought that the memory was on the CPU board as well. Is that not correct?
Derp. That's what happens when you wake up for work at 5:45 AM, kids. For some reason I thought the memory was on the mainboard.No, the RAM is also on the CPU board, as is the eMMC.
Everything that's tied together. A new CPU board will almost ALWAYS require a different memory, so it wouldn't have made sense to put that onto the mainboard (besides the technical difficulty that the memory should have as short traces to the SoC as possible).
I pictured that, removing the bottom plastic part under the ports, so no hole, no drilling. A simple aluminium or copper plate rectangle is ok.@EvilDragon
->Where did you want to have an opening and do you have a heatsink that would perfectly fit in there?
It could be pushed to the exterior, but there can be other solutions, I never saw an opened Pyra case.
And I don't _want_, I suggest.