Wally
I am a banana!
Give him the shark an xmas hat and i'll make that my avatar.
Finalizing the PCBs
- Thread starter EvilDragon
- Start date
Give him the shark an xmas hat and i'll make that my avatar.
rygD
Nihilistic Mystic
I vote for a hat with antlers.
Release Date of Pyra is when i finished Xenoblade Chronicles 2 on Switch (because the Girl "Pyra" plays a pretty Important part in the Story)..
But hopefully not, cause this game eats hundreds of hours..
Im Optimistic whit the Pyra Handheld, it will have its realease, the only question is when..
But hopefully not, cause this game eats hundreds of hours..
Im Optimistic whit the Pyra Handheld, it will have its realease, the only question is when..
Zwerg01
board's own troll
- Joined
- Feb 15, 2017
- Messages
- 95
I wonder why everyone is making super unrealistic predictions. Maybe because there is no project plan? Just think about how many tasks are open. Assembly, Certification, Manual, etc. So end of 2018 is more realistic in my opinion. (but before R.I.P)
crazyhorse
Newbie
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- Sep 9, 2009
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My guess is March 2019
Certification takes one day and labs currently have a waiting time of about 4 weeks. A quick test (to check if your system complies) doesn't take as long, so you'll get a lab for that in less than one week usually.
The final prototype is what's needed for the certification and for the pre-check, all we need is the new motherboard (which Nikolaus is currenty soldering).
So if the quick check is successful, the appointment for the certification can be made and in parallel, the new CPU boards be produced.
Once that has happened, the boards are ready for mass production.
For the case production, the tweaks are the main things (though they should mostly be done now, according to my contact).
There's no real setup time for the new company. You attach the molds to the machine and optimize parameters like heat, pressure and cooling time with samples until there are no visible marks left.
Assembly takes 10 minutes per person per Pyra, which is similar to the Pandora, and GC could easily deliver 100 Pandoras per week (even more, if need be). That's simply a question of man power.
The manual will be similar to the one of the Pandora and that had been written in two days and printed in one week. The packaging has a production time of 2 weeks.
I'm doing similar things regularly, I'm handling the production of the Retrode and all plugins, am producing shells, manuals, stickers and packaging for Everdrives and am now also taking care of the production of Cinemaware games in Big Boxes with goodies. Oh and I published a few Dreamcast games, where I also handled the complete production run.
Nope, the issue is neither a missing organization nor am I concerned about the production itself too much.
It's perfectly planned already when certification, manuals and packaging will happen. But that's not based on a date but on the status of the project.
Yes, the hardware (PCBs) turnd out A LOT more complex and beastly like me or Nikolaus ever imagined. Just take a look how long it took to analyze the CPU and memory instability issues. Earlier hardware (OMAP3) wasn't that fiddly but a lot more tolerant to design - but I guess the reason for that is that everything gets smaller and faster...
Also, the best organization doesn't work well if a main player (like the case company) doesn't do their job as planned AND you don't have the money to simple kick them and move to a new one tod finish the design.
That will ALWAYS throw you back - and you can't do much about it.
There might've been a few organizational things I could've done a lot better, if you loom back, but that's life. No one always makes perfect decisions.
I am not aware of big organizational mistakes I made, but feel free to mention what you think I wrongly and let me know how you would've handled it to prevent any unexpected delays.
Sent from my XT1650-03 using Tapatalk
PowerGod
Forum Addict!
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Eight Bit
Hardcore Member
You make it sound like it can all be done within 2 months EvilDragon...
Fingers crossed.
Fingers crossed.
Caine
Hardcore Member
I agree, that sounds about right. If we are really lucky then maybe Q4 2018, but I am not counting on it.
Silent-Hunter
Hardcore Member
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- May 29, 2010
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Why so late? There isn't THAT much left to do.
[doublepost=1512832486,1512832429][/doublepost]Why so late? There isn't THAT much left to do.
[doublepost=1512832486,1512832429][/doublepost]Why so late? There isn't THAT much left to do.
„What’s my Ordernumber???“
Does the heatsink perfectly fit the available space or is there going to be a soultion to hold it in place? I think it's not a good idea to let the heatsink rattle around in the case, as this may put unwanted strain on the BGA of the SOC, for example in case you accidentally drop your Pyra.
Is there going to be additional heat conducting material connecting the heat spreader or heatsink and the metal parts of the USB port? Maybe this can help removing some heat, at the cost of heating up connected USB devices. I'm thinking, maybe something connected to the USB port could serve as an additional heatsink...
What are the estimated minimum and maximum operating ambient temperatures for the Pyra? Outside temperatures between -15°C and 35°C are considered normal where I live. It can make a huge difference in SOC cooling!
Is the OMAP5 capable of setting frequency and voltage individually on CPU cores? This could help to keep the SOC cooler without loosing single thread performance.
Also, I'm happy that transparent cases are finally confirmed by ED
Is there going to be additional heat conducting material connecting the heat spreader or heatsink and the metal parts of the USB port? Maybe this can help removing some heat, at the cost of heating up connected USB devices. I'm thinking, maybe something connected to the USB port could serve as an additional heatsink...
What are the estimated minimum and maximum operating ambient temperatures for the Pyra? Outside temperatures between -15°C and 35°C are considered normal where I live. It can make a huge difference in SOC cooling!
Is the OMAP5 capable of setting frequency and voltage individually on CPU cores? This could help to keep the SOC cooler without loosing single thread performance.
Also, I'm happy that transparent cases are finally confirmed by ED
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Caine
Hardcore Member
There wasn't THAT much left to do a year ago either.
Apparently you are assuming it will arrive a lot sooner, perhaps you are right, time will tell.
My guess is that my estimate is closer than yours. If it is not, well then I will have my Pyra sooner than anticipated and I still win
The material and heatsink stick on top of the USB port. And they're far away from the SoC, they can't cause ANY strain to the BGA.
The heatsink almost fits perfectly, but I'm also looking to find a bit better ones (there's 0,5mm left
))What are the estimated minimum and maximum operating ambient temperatures for the Pyra? Outside temperatures between -15°C and 35°C are considered normal where I live. It can make a huge difference in SOC cooling!
The OMAP5 is made for industrial usage, which means it's suited for -40 °C to 100 °C.
The LCD has an operation temperatur of -20 °C to 70° C, which sounds good as well.
You can completely switch off a core, not sure if frequency and voltage can be set individually, but my guess is no.
ible
professional vim user
huh, that's weird. on x86 you can choose the frequencies separately for different cores...
levi
Still fresh, damnit!
I went and checked my Pandora charging last night, sorry for any delay. Looks like I was completely out there - it only takes up to 900mA when the battery was at about 30% and that seemed to drop down as the battery filled. If the Pyra can take 1.5A when charging it would probably charge quicker even than my Pandora does, but I guess we'll have to wait and see.
I'm not sure how long my Pandora takes to charge - all I can say is it's usually done within 8 hours.
I'd assume under Linux it's all under the control of the governor, regardless of the CPU architecture. You could build a governer that sets the frequency regardless (or until the unit cooks itself would be more sane, I guess), but I've no idea how easy that is.
The material and heatsink stick on top of the USB port. And they're far away from the SoC, they can't cause ANY strain to the BGA.
The heatsink almost fits perfectly, but I'm also looking to find a bit better ones (there's 0,5mm left
I meant causing strain by the heatsink pulling or pushing the heat spreading material as it moves, which is in turn glued to the SOC. Nevermind, If the heatsink is a perfect fit, there's no problem. I suspect the adhesive is of the heat conducting type?
That sounds very nice. What about the battery? Also, AFAIR those are already ordered. Is there a risk of deep discharge whlie in storage?
edit:
I found this two year old post mentioning that batteries are already delivered. I hope GC doesn't charge much for parts storage...
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WizardStan
Mega GP Mania
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Yeah, this is limited in the software; it can go faster. I don't know if it still needs the module to be rebuilt or if that parameter has been made runtime configurable, but in either case I wouldn't recommend it.
Djoga'Ro
moonstruck
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- Apr 3, 2016
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Was the heat-duct solid copper? Then stretch it. Or in any case move it in relation to the SoC.The material and heatsink stick on top of the USB port. And they're far away from the SoC, they can't cause ANY strain to the BGA.
The heatsink almost fits perfectly, but I'm also looking to find a bit better ones (there's 0,5mm left
Half that I'd find acceptable, but 8h is too much. I hope the Pyra is quicker in that regard.
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