Only the unreasonable ones who don't understand how modern mobile CPU/SoC systems work (optimized for peak/valley load processing not always pegged). How is the truth not relevant? All CPUs generate heat. CPU manufacturers take the exact same CPU and over/under clock them to fit specific thermal envelopes all the time. The Pyra, and pretty much every other device designed to be able to operate while pocketed, has a pretty low thermal envelope. However, newer CPUs with smaller processes (14nm instead of 35nm) use less energy per unit of computing. Future SoC options for the Pyra will likely have the same or potentially less power requirements and thus produce less heat. However, this doesn't preclude using a higher max W and max TDP processor - so long as everyone understands that it will only be able to sustain those rates for short bursts. I agree that some consideration should be given toward a radiator - i.e. a heat shedding component. But, that should be a consideration for a future product revision or add-on and not the current Pyra. I have shared many ideas around this over the last several years. The shortest path to being able to really shed heat is to replace the lower plastics (battery level surrounding piece) with a milled aluminum piece. This would radiate and conduct to the surrounding air AND the user's hands - making it liquid cooled. The single piece of milled aluminum to replace that piece of plastics would cost $000s to develop and would need to add charges on the order of $75-$150 per unit. Short of that would be to run a sheet of aluminum through between the SoC board and main board, under the SDXC slots and fill in the right half of the case front with folds/ribs for added surface area to act as a a convection radiator. Since this could be made out of stamped & folded sheet aluminum, it would not be nearly as expensive. It would still require a case mold revision - and as such should not be considered at this time. ED's placement of a heat capacitor/sink in the case void under the USB ports intrigues me for possible future user modifications. I could see potential to cut out a section of the case plastics, create a mold negative, create a clay mold then pour a solid silver heat sink with radiator ribs that fits into the same space plus gets exposed to the air. (If you're going to dream... it would take ~$150 in silver metal. Why silver? It has the highest thermal conductivity short of truly exotic and expensive stuff.) It could also be done using aluminum which would be nearly as good or copper if you have access to an oxygen free mold pour environment or lead if you don't care about health & safety. The point here is that from the placement of EDs heat sinks/capacitors, there is nothing but a thin plastic wall between that spot and the outside. If the chunk of metal can fill that void entirely, it wouldn't take much to cut some windows to expose that metal to the outside world. But - that is a customization for the modifications community for now and doesn't need to happen for Pyras to happen.