Well, how big should be a cooling soluion to handle a recent high end Snapdragon SoC for instance? Would it fit in a 10" Tablet at least?
Hm, hard to tell, as this depends on multiple things.
Basically, an SoC throttles if it overheats. So the general idea is to get the heat away from the SoC as fast and good as possible.
That's the first step. Metal has a good thermal conductivity, which is why copper heatpipes are used to move the heat away into a heatsink.
Let's imagine we have a totally closed environment here (so no heat exchange with the outside world):
Thanks to the heatpipe and heatsink, the heat moves away from the CPU into the copper block, slowly heating it up.
As soon as the copper has the same heat as the CPU is producing, it won't cool anymore - and the CPU will start to throttle to reduce the heat.
Now let's open that up to an open enviroment, where there's a cooler area around the heatsink.
The heatsink heats up and will start to emit the heat to the outside world, therefore, it will cool down a bit.
Thanks to that additional cooling, the heatsink won't heat up as fast as it would before, so the CPU will take even longer before it starts to throttle.
There's one more factor though: The bigger the surface of the heatsink is, the better it can emit the heat to the outside world.
If you use fins on the heatsink, you increase the surface (compared to having a flat one), therefore it will emit more heat.
(on the other side, the heatsink has less material so it will heat up a bit faster as well
)
To be able to FULLY cool the SoC, the emitted heat has to be AT LEAST as much heat than the SoC produces.
(and of course the heatpipe needs to be capable enough to move the needed amount of heat from the SoC to the heatsink).
Once you reach that sweet spot, you can basically run the CPU with full load for as long as you like.
BUT there's another thing to take into account:
The heatsink emits heat - which means it will warm up the surrounding air as well. This will slow down the cooling overtime as well, unless the warm air is being replaced with cool air once again.
And that's what a fan does: A fan sucks cold air in, blows it through the fins and blows the hot air out. That's how you keep the air inside the fins of a heatsink always cool.
Again: The more surface the copper has, the better the fan does its job.
As quick summary:
1. The SoC produces heat. Depending on how much heat it produces, the surface of the SoC is enough to keep it cool (like with the Pandora).
2. If the surface is not enough, you need to increase the surface and add something that cools it down. For example: a heatsink. If you make it big enough and give it enough surface, you're done.
3. If the heatsink can't be put directly onto the SoC (because of space issues), you need to have a heat pipe to move the heat away from the SoC into the heatsink. The heatpipe needs to be big enough to be able to move away ALL the heat the CPU produces.
4. If you can't make the heatsink big enough to keep the CPU cool, you can add a fan to blow away the heat. The more surface (fins) the heatsink has, the better that works.
5. If ALL of that isn't enough to keep the CPU cooled, then it will only help to EXTEND the time until it throttles. Depending on the heat and the efficiency, it can extend the time by only a few seconds up to hours.
There are quite a few factors playing to the whole heat section