vcoleiro1
Hardcore Member
- Joined
- Jan 23, 2011
- Messages
- 4,685
There won't be any special heatsink, it's a 0,5mm thick heatpad (similar to what the GPD XD has on the battery).
The OMAP5 was still produced as a mobile processor back then, so it shouldn't produce as much heat.
Any photos of it ED?
Also , a sort of question, probably deserves a sort of answer . Anyway, I was wondering, since the Pyra has an upgradeable SOC daughter board, it isn't unforseeable that a future more powerful SOC may generate a lot more heat. Yet the Pyra has no cooling provisions for such an event. Doesn't that make the SOC being replaceable a bit challenging for need of a better word, ie if a future SOC does turn out to generate a lot more heat to get all it's performance - which is very possible, the current cooling solution wont cater for it.
I'm sure you have thought about this, and I was wondering what your take on this is? Perhaps there's room in the Pyra you have left to allow for a DIY cooling upgrade?
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