Update regarding the cases (and some other things)


On the bright side - we're 7 pages into comments on a news post about cases that is only 3 days old. A very involved community.

OK, so the topic has shifted a few times...
 
Looks like I don't have to visit Greece after all.
Some pictures from today my contact made.
Most of the parts are still lying in water (to cool off), so he couldn't take pictures.

But here are some of the parts that are already out of the water, including the machines at work.
Beware of crappy smartphone quality :)

IMG_20170508_154609.jpg IMG_20170508_154617.jpg IMG_20170508_154622.jpg IMG_20170508_154629.jpg IMG_20170508_154634.jpg IMG_20170508_154638.jpg IMG_20170508_154643.jpg IMG_20170508_154648.jpg

They're also trying out a different material tomorrow.
 
Out of interest, What's the goal of this other material test? What are they changing?

Probably to achieve different looks, etc.
I don't know myself, they haven't told me :)

I want matted cases, not glared once. However, looking at pictures of the matte GPD Win which have been made with smartphones, it also looks very glarey, so I guess this is just an effect there.

I'll make proper pictures once I receive them,
 
Nice, thank you for the pictures!

I’m curious though, I highlighted some areas where the plastic seems to have a recess. Is the case supposed to be flat at those places or is it the expected relief? Or is it light that, for some reason, makes those weird-looking reflections?
 

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6. Multiplexer bypass solution still to be tested; if not effective, an alternative solution might need to be found.
9. New prototype hardware including fixes (some already identified) needs to be made. And tested.
10. [Possible final iteration of prototype hardware.]

12. Prototype of thermal solution needs to be made and tested.
13. [Possible iterations of thermal solution.]
14. Thermal solution components must be mass produced.

16. Final tweaks to keymat need to be made and tested.

6, 12, 13, 14, 16 are all done/not necessary

I was shocked and upset to see what I'd written quoted with yet another obstreperous and belligerent post by m@t. :( But then I realised that this had happened through the quirk of the forum software that merges consecutive posts!

I'm happy to hear that more things have been ticked off the list already or will be entirely unnecessary. :) Seems I missed some things. I hope you won't mind me asking for clarification of some of them.

Re: 6 (and 9 to 10):

In the initial post in this thread [1], EvilDragon said that zmatt had not had an opportunity to complete testing of the multiplexer bypass, but had set aside some time to work on it this weekend (the one that's just finished). So it seems to me that 6 is not quite yet done. Has there been further news on this that I've missed?

Re-reading the post though, my understanding is that, if zmatt doesn't turn up the need for any modifications that can't be tested by jumpering the existing prototype, then there will be no need for another prototype run, and we can go straight to mass production. Which would be very nice news and it could make 9 and 10 disappear. :)

Re: 12, 13, and 14:

By the "thermal solution" here, I didn't mean the measures that have been taken in the circuit boards themselves, but rather the solution external to the circuit boards. I'm fuzzy on the details, but I had imagined a thermal connection widget between the CPU board and the main board and a large aluminium plate between the CPU board and the case. Was there a post that I missed that said that the design of these had been finalized, and indeed that the parts have already been mass produced? Or do you mean that these parts have been determined to be unnecessary?

Re: 16:

I thought that the purpose of mailing the current prototype keymat around [2] was to form a consensus about whether it is in the Goldilocks zone, of if it is now slightly too soft. Also, wasn't there a very recent tweak to the design of the keymat to resolve the slightly mushy d-pad problem? EvilDragon also mentioned minor modifications to the size of the ABXY keycaps. These three items were what lead me to think that there would be, or that there might be, another keyboard prototype before the final version is mass produced.

[1] https://pyra-handheld.com/boards/threads/update-regarding-the-cases-and-some-other-things.80376/
[2] https://pyra-handheld.com/boards/threads/test-the-keymat.80259/
 
Actually , I wouldn't mind seeing some more info on the final thermal solution. Some pics of the heat plate/sink would also be great
 
I don't think they're glossy fwiw. Looks like they have strip lighting there, so all you're getting is the highly scattered reflection of two or three flourescent strips there. And highly scattered reflections is what you get when you have discrete light sources on matte material.
 
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