levi
Still fresh, damnit!
Yeah, but it's been reported that once ED presses the big red button PCBs can be produced within 2 weeks. It takes something like that just to send a few dozen cases from Greece to Germany.
So I am not exactly sure where is the bottleneck
simple spray glue is normally way faster than peeling the protection film from a sticker off
https://www.3m.com/3M/en_US/company-us/all-3m-products/~/All-3M-Products/~/3M-Super-77-Multipurpose-Spray-Adhesive/
Congratulations!... got married and had a kid ...
Congratulations!
So I am not exactly sure where is the bottleneck ?
How about a lottery?
Everybody is allowed to say, when he/she thinks the release date is two months ahead (only once).
The one with the best estimate get's his Pyra signed by Evil Dragon .
Wow, that would've been like a month of back and forth with the old company.Aaand a quick update:
@azouls (he introduced himself in the Pyra Render spectrum thread, he's one of the guys actively working on our moulds now) had another idea to improve the quality have less discolorizations / shrinking marks: By using a machine that heats up the mold as well, the plastic might flow better. So he tried that yesterday - and it improved things a lot!
So another step forward, besides fixing the issues the molds itself might have.
A first set of samples (with different materials) has been shipped to me on Monday, but that doesn't include the improved one with that special machine yet.
So yes, you can see, things are moving a lot faster now than before
I guess having both plastic and moulds at the same temperature should make plastic flow better.
Any updates on prototye assembly ?
Indeed, but it would also stop the plastic from solidifying . So temperature will have to be a compromise between reducing flow issues and a sufficient cooldown to make the part survive ejection.I guess having both plastic and moulds at the same temperature should make plastic flow better.
Indeed, but it would also stop the plastic from solidifying . So temperature will have to be a compromise between reducing flow issues and a sufficient cooldown to make the part survive ejection.