The tests continue...


EvilDragon

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Last week, the shoulder buttons arrived at my place. They aren't too spectacular, so I didn't take any pictures yet. :)

The case part received a small last-minute change:
In order to improve the logo on the backside, it was decided to make the logo surrounding with laser-cut aluminium.
Doing it fully in plastic would make it either look cheap or would extremely difficult to produce reliable and seamless.

The laser-cut aluminium will be a rectangle with rounded corners and the transparent logo inside.
I think you can imagine it a bit better with this picture of the lid, where you can see where the logo plate will be inserted:

lid.jpg

This does not cause a long delay, btw, as the change to the mold is minimal and while they were working on that solution, they simply continued to work on a different mold (the one with the DPad, as that is important so I can test the keymat and submit the final changes).
So I will get the molds in a different order than planned, but that's mostly it :)

Okay, what did Nikolaus do last week?

He didn't find the time yet to dive deeper into the stability issue as he would need a full day without any breaks for proper testings and he was a bit busy last week.

However, he continued to work on the remaining tests, and here's the current result (only the newly tested stuff listed):

* All SD Card slots are now working fine without errors in Linux
* Headset (incl. automatic switching and microphone) working.
* Vibra-Motor working
* Audio works
* Touchscreen works
* Display with rotator chip works
* USB ports work

Most other things (sensors, Wifi, Bluetooth, 3G/4G, keyboard, etc.) have already been tested before.

What's left to do before we consider the prototype finished:

* Fix the stability issue
* Test HDMI
* Test USB3.0 (we only tested the port with 2.0 so far)
* Implement and test the SDD AntiTear-Driver (code is almost finished)
* Test the fuel gauge and charging circuit for the battery
* Fix eMMC/MicroSD-Switch (needs a different part)

So... that's mostly it... the list was quite long a few weeks ago, now most of the main components have already been tested and confirmed to be working. Only a few things remain!
 
The fresh Smell of Progress!!!! *Gets antsy and stamps feet*

Thanks for the Update ED!
 
If you are going to use aluminum for the back of the screen, then the aluminum might make a good heat sink. I normally do not touch the back of the screen when using the Pandora computer, so it does not matter if the back of the screen becomes hot.
 
If you are going to use aluminum for the back of the screen, then the aluminum might make a good heat sink. I normally do not touch the back of the screen when using the Pandora computer, so it does not matter if the back of the screen becomes hot.
Yes, the aluminum could be a good heat sink, but I think since it is at the back of the screen, it will be very hard to create the connection between the SoC and the screen. The SoC is locate at the main body of Pyra, right?
 
Fantastic. The logo insert is exactly how I envisioned it would get made. Allows for customization. :)

Edit: The insert should however be on the other side so that its held in, you dont have to glue it on then.
 
Last edited:
Fantastic. The logo insert is exactly how I envisioned it would get made. Allows for customization. :)

Edit: The insert should however be on the other side so that its held in, you dont have to glue it on then.
It wouldn't look as good if it's on the other side and you'd need to glue it anyways, as it would rattle around :)
 
I remember Craigix sit in winter in his garden whit the Pandora in Snow and his allmighty furhat to show how less heat the pandora emited..
So pyra would melt the snow??
And how many heat would it emid whit normal Pandora Tasks?? Dreamcast, N64 DS PS1..
For prozessor intensivd tasks, it could be usefull to let one SD Slot empty ..
Or to open up the batterie conpartment and run it from Wall Plug..
 
I'm really worrying about what would happen to the sd cards with the heat, as I'm planning to add one in each slot.
 
Yes, the aluminum could be a good heat sink, but I think since it is at the back of the screen, it will be very hard to create the connection between the SoC and the screen. The SoC is locate at the main body of Pyra, right?

A Pyrolytic Graphite Sheet could conduct heat from the system board to the aluminum at the hinge of the screen.
 
Nice progress :D.

Will the headset port be a line in + microphone combo or a simple female jack for audio out only?
 
Will the aluminum plate sit flush with the case plastic (I assume so, just verifying)?

Yes.

I'm really worrying about what would happen to the sd cards with the heat, as I'm planning to add one in each slot.

Nothing, as 80°C heat on one spot goes down to temperatures like 40°C when you distribute them properly.
 
I'm really excited for the pyra and will do my best to import one for me, but one thing that got me thinking, don't you worry that the pyra will hit the market with a already obsolette hardware or have I missed something?
 
Since there is going to be an aluminum plate, you might as well just give us the whole case in metal. You know you want to. ;)

I do like the logo solution, and I think the end result will look better since there won't be light bleeding through the opaque areas of the logo. As ck mentioned, the side benefit is easier customization.
 
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