And suddenly it works.


I found this:

7126tonGE6L._SX425_.jpg


That can be attached on the botton in the right sd card reader to take away some heat...
good joke
 
How about leaving a square shaped blank space in the case (if it hadn't been produced yet) and placing a vent or other technological apparatus to shed the heat out?
Probably silly to the technically-informed, but trying my best to contribute.
 
How about leaving a square shaped blank space in the case (if it hadn't been produced yet) and placing a vent or other technological apparatus to shed the heat out?
Probably silly to the technically-informed, but trying my best to contribute.

There are multiple problems with your idea:
  1. Changing the outside is going to make the Pyra a lot bigger and/or with a weird shape it's not going to fit anywhere
  2. The CPU is on the upper side of the SoC-board, so that the heat can get dissipated along the mainboard. By that, it's also a bit shielded to air by the two boards
  3. At the spot you'd put the square-shaped hole is already the battery
And most importantly:
Nobody knows exactly how much heat the CPU is going to produce. By the time the A15 and Krait were put into phones, the production companies didn't do a lot to dissipate heat - a huge PCB with a copper core just atop the SoC with some carbon in between there and 2 metallic SD card slots on the outside could already be enough. Just wait a few weeks and ED/hns will test that, and if it doesn't work at that time, then you can think of crazy solutions. But even if that should happen I think Nikolaus can handle it, it's by far not the first mobile device with passive cooling he's designed.
 
As to heat dissipation, could some vents be cut in the case somewhere to get convention going while the lid is open?
Most other heat-removal ploys I can think of require a major case rework..

Are there not already holes for the speakers? Would there be any way to make use of them for convection, too?
 
If I understand the plan correctly the idea is to have a heatsink on the SoC, and heat pipe that to the SD card readers, which gives it access out. Unless people are anticipating they they're going to be stressing their Pyra for extended periods I expect that will work just fine, much like the Surface Pro 4's similar system for the m3 variant:

sp4innards-100624160-large.jpg
 
Are there not already holes for the speakers? Would there be any way to make use of them for convection, too?
I was thinking about the same thing the other day, and that is what led to me thinking I might drill holes to cool it if it will help. I kinda doubt that location will help much with all the trapped hot air, but it was the first place I was thinking of messing around with it.
 
Are there not already holes for the speakers? Would there be any way to make use of them for convection, too?
That would likely ruin the sound output, as that part was designed in accordance to the speaker's manufacturer iirc.
 
There are multiple problems with your idea:
  1. Changing the outside is going to make the Pyra a lot bigger and/or with a weird shape it's not going to fit anywhere
  2. The CPU is on the upper side of the SoC-board, so that the heat can get dissipated along the mainboard. By that, it's also a bit shielded to air by the two boards
  3. At the spot you'd put the square-shaped hole is already the battery
And most importantly:
Nobody knows exactly how much heat the CPU is going to produce. By the time the A15 and Krait were put into phones, the production companies didn't do a lot to dissipate heat - a huge PCB with a copper core just atop the SoC with some carbon in between there and 2 metallic SD card slots on the outside could already be enough. Just wait a few weeks and ED/hns will test that, and if it doesn't work at that time, then you can think of crazy solutions. But even if that should happen I think Nikolaus can handle it, it's by far not the first mobile device with passive cooling he's designed.

I see your point. Call me if you ever need a Rube Goldberg machine.

MFsLtD6.jpg
 
Perhaps, if the unit is really cooking and heating up the SD card slots, if enough heated air finds it way out of the front of the unit, holes there might be able to draw fresh cold air up, with the whole system acting like an inverse syphon. But perhaps there are enough holes for that already, and adding those will tend to weaken the case somewhat. They certainly wouldn't take hot air out unless you had the unit upside down. But it's an idea worth bearing in mind I reckon, if the SD slots tend just to recirculate hot air between them or something.
 
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