And suddenly it works.


Would putting heat dispensing utilities below the PCB and the stuff that it holds or on the side of the case make the case that much bigger, vertically? There has to be someone with some "ingenious" solution based on how Pyra is built.
Also, not sure, but I've heard of fans that can be pretty small.

As for Linux and Games, I'll make a list of games pretty soon.
 
I was thinking of drilling some holes in my case if heat is an issue and I can find some good places for them. Not sure if it would have much impact based on how heat is planned to be handled.

You'll need at least a submachine-gun to make some holes in it !!
 
You know nothing: Jon Snow

That is quite rude... I may have misspelled his name, although I could claim that my spell correction did do the misspelling... But to say that I actually know nothing is
a bit of of exaggeration, I think. :'( That hurts.
 
BTW is that an prototype USB to eSATA Adaptor which is connected to the Left USB Port?
No, it is an "USB to USB cable" which allows to measure signals and the current flowing from one end to the other and do other experiments. The design has an optional potentiometer to be a dummy load for the USB host power supply, so we can check how much current the port can provide.

The OMAP5-USB-to-eSATA adapter will look similar, but will be smaller.
 
You... did get the reference, didn't you?

I don't think I do:

johnsnow440.jpg
 
No, it is an "USB to USB cable" which allows to measure signals and the current flowing from one end to the other and do other experiments. The design has an optional potentiometer to be a dummy load for the USB host power supply, so we can check how much current the port can provide.

The OMAP5-USB-to-eSATA adapter will look similar, but will be smaller.
So how much can it provides?
 
No, it is an "USB to USB cable" which allows to measure signals and the current flowing from one end to the other and do other experiments. The design has an optional potentiometer to be a dummy load for the USB host power supply, so we can check how much current the port can provide.

The OMAP5-USB-to-eSATA adapter will look similar, but will be smaller.
Multimeter as a feature confirmed!
 
By the way, in case you didn't know:
The Pyra can charge the battery even when the system is switched off.
It even charges the battery when the CPU board is not even there - it's all handled by the charger chip.

This is the best thing I've heard in a while. I always hated that the Pandora didn't have a charging microkernel.

Here's hoping you find a good heat dissipation solution.

-God Ginrai
 
Maybe an extension cable to attach our own body to the Pyra will make the best dissipation solution ever made !!
 
Boiling helium is pretty good for keeping things cold, though I suspect extreme low temperatures would cause more damage than typical overheating.

As to heat dissipation, could some vents be cut in the case somewhere to get convention going while the lid is open?
Most other heat-removal ploys I can think of require a major case rework..
 
You realize that heatsink and fan height wise is about the thickness of the Pandora...
 
How about leaving a square shaped blank space in the case (if it hadn't been produced yet) and placing a vent or other technological apparatus to shed the heat out?
Probably silly to the technically-informed, but trying my best to contribute.
 
How about leaving a square shaped blank space in the case (if it hadn't been produced yet) and placing a vent or other technological apparatus to shed the heat out?
Probably silly to the technically-informed, but trying my best to contribute.

There are multiple problems with your idea:
  1. Changing the outside is going to make the Pyra a lot bigger and/or with a weird shape it's not going to fit anywhere
  2. The CPU is on the upper side of the SoC-board, so that the heat can get dissipated along the mainboard. By that, it's also a bit shielded to air by the two boards
  3. At the spot you'd put the square-shaped hole is already the battery
And most importantly:
Nobody knows exactly how much heat the CPU is going to produce. By the time the A15 and Krait were put into phones, the production companies didn't do a lot to dissipate heat - a huge PCB with a copper core just atop the SoC with some carbon in between there and 2 metallic SD card slots on the outside could already be enough. Just wait a few weeks and ED/hns will test that, and if it doesn't work at that time, then you can think of crazy solutions. But even if that should happen I think Nikolaus can handle it, it's by far not the first mobile device with passive cooling he's designed.
 
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