Kev2442
Still French
Well about that... Sorry not sorry ?I'm currently in pre-christmas hell
Sorry to be part of your Christmas orders.
Not sorry to choose you over Krikzz to help fund (by a small margin but still) the Pyra project.
Well about that... Sorry not sorry ?I'm currently in pre-christmas hell
I think a lot of CPU's have gold in them for connecting the chip to the pins in the package, don't know about the Pyra one.Half the world is wearing gold which is the biggest conflict material of all and no one can tell where theirs comes from...
Maybe we shouldn't be too hung up on this, it would be a tad hypocrite, especially if you have Apple and Samsung electronics at home too. (I do)
I know even little bits help too but I doubt 1000 Pyra's will fuel the war in Congo.
Lots(all) of dies use gold for pads but aren't the connections frequently done using aluminium ?I think a lot of CPU's have gold in them for connecting the chip to the pins in the package, don't know about the Pyra one.
Yes. But they can't handle the heat cycles that well.Lots(all) of dies use gold for pads but aren't the connections frequently done using aluminium ?
What?which is probably while almost any smaertp
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I have designed a custom cutout for the heatpipes so we can use two heatsinks (one below each USB port).
That won't increase the costs, doesn't need any preparation time (as laser-cutting the material out of the sheets is nothing special) and should vastly improve the cooling as well.
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It's not copper. It's some sort of pre-glued foam that has good thermal properties. Something like that: https://www.3m.com/3M/en_US/company...nterface-Pad-5519?N=5002385+3294001841&rt=rudI'm Sorry to say this.
But it's not that easy to find a company that will cut copper with laser.
There are two main reasons why:
The vapour of laser cut copper isn’t quite healthy.
The laser light could be reflected by molten copper and damage the optics.
The usual way to cut copper, brass, bronze and other copper alloys is water jet cutting or punching.
It looks like the heat dissipation traces go over just about all the chips of the CPU board, doesn't that mean the sinks will accumulate more heat and saturate faster than with just the CPU connected? Also, do the other chips heat up with CPU stress only or are they warm constantly? I'm not so sure it's wise to have all of them combined in one system...
Tantalum and electrolytic capacitors do not have this capacitance drop as a function of voltage, but they have their own problems.
Wow, it's much more complex then I thought. More complex then the initial straight band anyway.
It's not copper. It's some sort of pre-glued foam that has good thermal properties. Something like that: https://www.3m.com/3M/en_US/company...nterface-Pad-5519?N=5002385+3294001841&rt=rud
It looks like the heat dissipation traces go over just about all the chips of the CPU board, doesn't that mean the sinks will accumulate more heat and saturate faster than with just the CPU connected? Also, do the other chips heat up with CPU stress only or are they warm constantly? I'm not so sure it's wise to have all of them combined in one system...
So many questions, sorry
Now this little info changes a lot.
But heck, i am very sensitive to sirring noises. Ill take disadvantages any time as long as it makes no noise.
I wasn't actually thinking about the heat looping back to the other chips per-say, more about the sinks saturating faster because it also accumulates the heat from the other chips, causing the CPU to throttle faster than without the added heat from the other chips.It shouldn't, as the heat will always move where it's coldest - and that would be the heatsink.