spud42
Very Active Member
its not all the molds .. it will probably be only 1 mould that requires change. case bottom would be 1 set of molds, keyboard another, lid another and insert another. all the small parts like the stylus, buttons,stylus,stylus cover and nubs are more than likely to be on their own mold set. so that is the only one to require any changes.What could possibly go wrong?
We have been here many times before. Perhaps it should not, but somehow it will (two months™). I am not holding my breath.
show a bit of faith in our fearless Dragon Leader guys...
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This would be nice in a future PYRA CPU board. We could use the AI to create a simulated ED within the system
aint no way that is going to fit in a pyra case...and i mean the chip not that dev board. the TDP alone is way too high for any cooling solution that could fit inside the Pyra case.