MWeston said:
all 515 balls will pass the heat of the CPU up to the PCB and dissipate through the copper planes instead of getting trapped in the RAM chip and having to pass through it to the air. I have no data to suggest this will provide any significant benefit but it seems better than overheating the RAM chip!
while we're in OC and heat dissipation
I'd like to remind people that thermal expansion on ball grid array interconnects (BGA) like is used in the pandora between the board and cpu and the cpu and ram (so two possible points of failure) is part of what causes the red ring of death on XBox360s.
at some point the connections breaks from the mechanical stress due to different thermal expansion between the cpu and motherboard and you get a red-blinking paper weight.
pin-based cpu connections expand and contracts, ball-based cpu connections dont
the way the heat sink in the 360 is attached makes things a lot worst by bending the board and the 360 has very radical temperature changes on power on/off but still, if your Pandora fails after 1 or 2 years of 1Ghz you'll know why
OCing your pandora could reduce its lifespan significantly even if it runs perfectly fine at >600Mhz
the amount of mechanical stress is dependant on the DIFFERENCE between the cpu and board (and cpu and ram).
so for example OCing and adding 3 degrees going from
board at 28'C and chip at 29'C (non-OC, 1 degree difference )
vs
board at 28'C and chip at 31'C (OC, 3 degrees difference)
would mean roughly three times the mechanical stress.
(there's a lot more factors than that in reality and its not linear but you get the idea)