Actually, that part shouldn't be as big of an issue as you might be thinking. By making the SoC board modular - and that it includes the RAM on the SoC module, THAT part would need to be redesigned to match up to a future SoC. The 'main board' that has the keyboard on one side and the SDXC slots on the other is relatively 'dumb'. It's systems, for the most part, trunk to the connectors for the SoC module. In theory, any future SoC that can handle at least the I/O lines to the 'dumb' mainboard AND fit in the thermal profile of the device could work.
Designing a new SoC/RAM/eMMC daughter board is NOT insignificant. But - it is one component that should be able to be redesigned while keeping the rest of the hardware 'as is'.
I could see this evolving into a 'leap frog' effect. The Pyra comes out, gets wide enough adoption to justify it, gets a new SoC board. It will only be able to take advantage of the features already present in the main board. The main board & case can then get an 'upgrade' to fully take advantage of the new SoC's feature set (which may include things that haven't been invented yet). The combination of the two would be a Pyra II? But the point is that by having the system modular, it is hypothetically possible for each piece to receive upgrades independently.
Where I expressed skepticism above was to the idea of re-using the 'old' Pyra SoC componnent 3-5 years from now in a non-Pyra enclosure after an upgrade SoC has taken it's place in the Pyra. By then, a functioning used Pyra would likely have less value than a dumbed down box would - which would negate the need for a dumbed down box (with it's development costs) to house the module.
That doesn't preclude the Pyra from having 'sister devices' that use the same modular SoC setup - those could make sense far before the Pyra gets an SoC upgrade part.