The dimensions of the TI wl1251 and the TI wl1271 differ a great degree. Sadly, the TI wl1271 is larger, but this supports my assertion that the parts we plan to include on the PCB could differ in size which would lead to different optimal organization patterns on the PCB, which is even more reason why we can't just look at a Pandora PCB and say "where is there room?".
And the Omap5 is also significantly larger than the Omap3, but even that size difference looks rather small in comparison to what the possible
xG Module is eating up (I hope I got the right one). And there is still the RAM, which will too eat space (but I do not know how much, the pop package size may differ greatly from the size of single modules). And if I remember Eds FOSDEM speech correctly we will also need a heatsink which may limit the placement of parts too.