Tezzaron 3D Stacked Processor / Memory


edlee

Member
Joined
Dec 3, 2013
Messages
79
There is a company in the United States named Tezzaron which makes extremely high-bandwidth memory which runs with low power by stacking chips in three dimensions along with processors.  Perhaps in the future, the Pyra processor board can get an upgrade with Tezzaron technology.

http://www.tezzaron.com/about-us/
 
That page seems to promise a lot, but I see a lot of "Will" and "When" in the wording, which sounds like they don't have a fully realized product. 

Micron and Intel have been delving in 3D memory for a while too, they have a much bigger research budget and larger manufacturing capabilities. 
 
Last edited by a moderator:
Tezzaron has been in business for a number of years, doing work for government/aerospace/military/supercomputing applications.

http://sbirsource.com/sbir/firms/10481-tezzaron-semiconductor-corp

Because Tezzaron is smaller than Micron / Intel, I think that Tezzaron might be more willing to make a small run of specialized stacked processors/memory wafers for a Pyra computer to demonstrate to other higher volume customers what is possible.

Regardless of from where faster, low power memory technology comes, stacked processor/memory chips might be something to consider for the Pyra or some other future computer.
 
Small special runs for company's like this, especailly ones that deal with government/military and aerospace industries are still orders in the hundred of thousands of dollars if not more. 

Micron and Intel may be better at bringing the costs down to a reasonable rate.
 
Last edited by a moderator:
Isnt this what samsung has been doing with their SSDs for a while. I figured mixing chips into the mix is more a question of capability rather than idea.
Essentially, 3D DRAM vs 3D NAND.
 
Last edited by a moderator:
Back
Top