Am 07.02.2014 um 11:34 schrieb Michael Mrozek:
Am Fri, 7 Feb 2014 07:56:13 +0100 hat "Dr. H. Nikolaus Schaller" hns@goldelico.com geschrieben:
Certainly not an easy task... if we could use CPU modules, we could easily update future revisions, so that would be good.
An interesting article about that: http://www.androidauthority.com/intel-vs-arm-future-mobile-technology-338340...
I've not yet seen a 3rd party Intel benchmark, and I don't trust Intel benchmarks (it's known they faked it at some time), so we don't know if performance is better.
Of course, being able to run all the Humble Bundle Linux games directly on the native Pyra system would be nice as well...
Not easy, definitely not. Nikolaus: While I wait for the QUalcomm informations, could you do a quick check on Intel, whether it's feasible and wouldn't cause us issues in the hardware design?
Well, from a first glimpse it looks ok. We can hook it up to RAM, USB3, 2 USB2 hosts and I2C, GPIO and MIPI-Display.
One minor limitation may be that it has only 3 SD ports while the OMAP5432 has 4.
We get either a problem with the second SD slot or WiFi. But we can connect either one through USB (because the Atom has one more USB port).
But this is IMHO not a blocking point.
The SoC has the same size as the OMAP. Only the BGA pattern is more dense and has more balls to connect so that we might need more layers of PCB. But I did not look into the pattern - if half of them is GND it would be ok.
Hi, after someone sent me the links to the data sheets, I must say I am impressed by the Atom Z3770. It indeed looks as if it is really comparable - concerning interfaces.
One issue is that it is a 1300+ BGA in 0.4mm pitch while the OMAP5432 is 0.5mm (the 5430 would also be 0.4). So the system design of the 5432 is a little relaxed (being 20% more spacy).
With the Snapdragon discussions we now (again) have indeed three options to consider.
Maybe the best one to strive for would be replaceable CPU boards for all of them :)
This of course needs:
- well defined interface connectors (positions, signals)
- makes planning more difficult (we need to know in advance which
versions in which quantities) 3. reduced number of units per variant
- increasing the total price a little 4. we have to maintain 2 or 3
kernels + drivers
One solution could be that we only do step 1, publish some interface specifications and leave it to others to really design, build and maintain the alternate SoC boards.
So my proposal would be to continue with OMAP5 (because we know it best) and leave the Snapdragon and Atom designs to the community (but help them to succeed if possible).
BR, Nikolaus
PS: after studying the data sheets a little - the 1V Core power line may draw up to 6 Amperes (!) This is a special challenge for the power controller design _______________________________________________ Kernel mailing list Kernel@pyra-handheld.com http://pyra-handheld.com/cgi-bin/mailman/listinfo/kernel
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