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Not sure about the SOCs power domains, but In the cpu-sch.pdf, I see mostly bulk capacitors (10uF, 2.2uF) on non-RAM supply lines. Because of capacity vs. size, the dielectric of bulk capacitors is often "slow" (1.5GHz clock means that you will see those 1.5GHz on the bypass capacitors, which...

That's why it is/should be called systemd/linux -- maybe sometime it will be systemd/uboot with boot-to-systemd ... wait ... why stop there? why not integrate a bootloader into systemd? Afaik (one of the) main reason(s) for this is to unify init "scripts", so a vendor can ship them (instead of...

If you get a "bare" sim, that means they don't care. Surely they can disallow devices by contract. But why would they?! The modem chip has to comply to all regulations, but you would break laws if it didn't. That's not a problem with the phone company provider.[/S]

Don't think so. Pads are below the "chip" and will be soldered. https://www.pyra-handheld.com/wiki/index.php?title=File:Pyra_PCB_componentside.jpeg

Downlink 21Mbit vs. 150Mbit. But it really depends on the network load - as long as few people use LTE it is really fast. In areas where lots of people use 3G (most android users don't turn off their mobile data), 3G may be slow. In areas with good reception (and less than 100% load) the only...

*scratch* then I misread the other post. I thought all the components together were 250 EUR (incl. case, etc. but without failure rate and manufacturing/testing)

It's not *250%, but +250%, which means *350%. So that means 500 EUR is +100%.

Nah, I'd love having a phone with gcc and xorg again, the performance is not the issue for me (maemo worked fine on the original cpu imho), it's just the price. My current hopes are to use a pyra with gsm, headset and ~1 day battery life as phone/replacement... as long as the headset port is a...

Under normal circumstances I'd say +200% is reasonable for small to medium batches, where 100% goes to handling (sales, returns, support, ...) and up to ~100% may be profit *after* return of investment. But that may be slightly different for pyra, since the part costs are pretty high, so +100%...

Also don't forget to mention the fact that most manufacturers (try to) apply those interfaces not because they need that kind of throughput but for marketing reasons.

Because ED (or the manufacturer) wants to have the parts in original packaging. Most obvious reason for that is MSL (moisture sensitivity level). PS: I know that a lot of distributors reseal even single pieces of components, including a MSL color card, but with the amount of headaches we had...

Having said that... the other viable option that comes to mind is to only have a "rescue system" on the eMMC and the real OS on the internal SD card, like in android/cyanogen dual-boot. Pro: swappable OS + no wear of the eMCC, which can't be replaced Con: eMMC is more reliable and probably...

After having seen a dead n900 MMC, I'd say go for as much size as possible for wear leveling. Besides that, most (cheap) uSD cards just don't compare to eMMC for small files. You see this, when booting android from an uSD card vs. internal eMMC. I guess It would be best if each and every system...